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Silicon Nitride square substrates, also commonly referred to as square wafers or plates , are high-performance ceramic materials in the form of flat , rectangular sheets . They are engineered to possess a unique combination of mechanical , thermal , and electrical properties , making them indispensable in a wide range of demanding industrial and electronic applications .
Brief
Silicon nitride exceeds other ceramics in thermal shock resistance. Its strength does not deteriorate at elevated temperatures, hence it is most appropriate for engine and gas turbine parts, including turbo charger rotors, diesel engine glow plugs and hot plugs.
The characteristics of silicon nitride ceramics are:
Silicon Nitride Application:
Used as an insulation layer or support structure to protect sensitive components during high-temperature processing in semiconductor manufacturing and other electronic components.
Used for the internal structure of high-temperature furnaces, such as brackets or thermal barriers, to improve the uniformity of temperature inside the furnace and reduce energy loss.
Used as a corrosion-resistant and high-temperature insulation component in chemical reactors or processing systems.
Aerospace and Advanced Engineering Applications
In environments that require extreme resistance to temperature and mechanical strength, such as thermal protection systems for spacecraft or components of high-speed machinery.
Silicon Nitride square substrates are advanced engineering materials prized for their superior mechanical robustness, outstanding thermal shock resistance , and excellent electrical insulation. Their square shape is particularly advantageous for efficiently tiling and processing multiple units in industrial equipment . These properties make them a material of choice for the most challenging applications in power electronics , semiconductor manufacturing, and high-temperature industrial processes.
Parameter
| Item | gas pressure sintering | hot pressing sintering | reactive sintering | pressureless sintering |
| Rockwell hardness (HRA) | ≥75 | - | > 80 | 91-92 |
| volume density(g/cm3) | 3.25 | > 3.25 | 1.8-2.7 | 3.0-3.2 |
| Dielectric constant (εr20℃, 1MHz) | - | 8.0(1MHz) | - | - |
| electric volume resistivity(Ω.cm) | 10¹⁴ | 10⁸ | - | - |
| breaking tenacity (Mpa m1/2) | 6-9 | 6-8 | 2.8 | 5-6 |
| Elasticity modulus (GPa) | 300-320 | 300-320 | 160-200 | 290-320 |
| thermal expansivity (m/K *10⁻⁶/℃) | 3.1-3.3 | 3.4 | 2.53 | 600 |
| thermal conductivity (W/MK) | 15-20 | 34 | 15 | - |
| weibull modulus (m) | 12-15 | 15-20 | 15-20 | 10-18 |