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high hardness insulation silicon nitride ceramic plate for automotive industry-0

Silicon Nitride

Home >  Products >  Industrial Ceramics >  Silicon Nitride

High Hardness Insulation Silicon Nitride Ceramic Plate for Automotive Industry

Silicon Nitride square substrates, also commonly referred to as square wafers or plates , are high-performance ceramic materials in the form of flat , rectangular sheets . They are engineered to possess a unique combination of mechanical , thermal , and electrical properties , making them indispensable in a wide range of demanding industrial and electronic applications .

Introduction

Brief

Silicon Nitride Si₃N₄ Square Substrates Introduction
Silicon Nitride square substrates, also commonly referred to as square wafers or plates, are high-performance ceramic materials in the form of flat, rectangular sheets. They are engineered to possess a unique combination of mechanical, thermal, and electrical properties, making them indispensable in a wide range of demanding industrial and electronic applications.
Silicon Nitride (Si3N4) is 60% lighter than steel but strong enough to survive some of the most demanding applications in a variety of industries. This lightweight, high-strength ceramic material is used as an alternative to stainless steel, super alloys and first-generation ceramics such as Al2O3 and ZrO2. It offers excellent thermal shock resistance and high fracture toughness, compatibility with nonferrous metal melts, and improved structural reliability compared to other ceramic materials.
Details

Silicon nitride exceeds other ceramics in thermal shock resistance. Its strength does not deteriorate at elevated temperatures, hence it is most appropriate for engine and gas turbine parts, including turbo charger rotors, diesel engine glow plugs and hot plugs.

The characteristics of silicon nitride ceramics are:

  • 1. Exceptional Mechanical Strength and Hardness :
    · Silicon nitride exhibits high fracture toughness and excellent wear resistance . It is significantly stronger and harder than many other technical ceramics, which prevents cracking and deformation under high-stress conditions.
  • 2. Outstanding Thermal Properties:
    · High Thermal Shock Resistance : It can withstand extremely rapid temperature changes without cracking, a critical property for applications involving rapid heating and cooling cycles.
    · Low Thermal Expansion : Its coefficient of thermal expansion is very low , which ensures excellent dimensional stability across a wide temperature range.
  • 3. Excellent Electrical Insulation:
    · Silicon nitride is a very good electrical insulator , even at high temperatures . This makes it ideal for isolating conductive components in electronic devices.
  • 4. High Chemical and Corrosion Resistance:
    · It is highly inert and resistant to corrosion from most acids , alkalis, and molten metals , ensuring long-term reliability in harsh environments.

Silicon Nitride Application:

  • electronics manufacturing

Used as an insulation layer or support structure to protect sensitive components during high-temperature processing in semiconductor manufacturing and other electronic components.

  • high-temperature furnace

Used for the internal structure of high-temperature furnaces, such as brackets or thermal barriers, to improve the uniformity of temperature inside the furnace and reduce energy loss.

  • chemical equipment

Used as a corrosion-resistant and high-temperature insulation component in chemical reactors or processing systems.

Aerospace and Advanced Engineering Applications

In environments that require extreme resistance to temperature and mechanical strength, such as thermal protection systems for spacecraft or components of high-speed machinery.

Silicon Nitride square substrates are advanced engineering materials prized for their superior mechanical robustness, outstanding thermal shock resistance , and excellent electrical insulation. Their square shape is particularly advantageous for efficiently tiling and processing multiple units in industrial equipment . These properties make them a material of choice for the most challenging applications in power electronics , semiconductor manufacturing, and high-temperature industrial processes.

Parameter

Item gas pressure sintering hot pressing sintering reactive sintering pressureless sintering
Rockwell hardness (HRA) ≥75 - > 80 91-92
volume density(g/cm3) 3.25 > 3.25 1.8-2.7 3.0-3.2
Dielectric constant (εr20℃, 1MHz) - 8.0(1MHz) - -
electric volume resistivity(Ω.cm) 10¹⁴ 10⁸ - -
breaking tenacity (Mpa m1/2) 6-9 6-8 2.8 5-6
Elasticity modulus (GPa) 300-320 300-320 160-200 290-320
thermal expansivity (m/K *10⁻⁶/℃) 3.1-3.3 3.4 2.53 600
thermal conductivity (W/MK) 15-20 34 15 -
weibull modulus (m) 12-15 15-20 15-20 10-18

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