9F,Bldg.A Dongshengmingdu Plaza,No.21 Chaoyang East Road,Lianyungang Jiangsu,China +86-13951255589 [email protected]
Basic Material Composition:
Silicon nitride plate is based on silicon nitride (Si₃N₄) ceramic matrix as its main constituent, belonging to high-performance structural and functional integrated ceramic material.
Core Industry Positioning:
It acts as a pivotal advanced semiconductor ceramic substrate and thin-film wafer raw material, serving as an irreplaceable basic component for multiple high-tech industries.
Main Downstream Application Fields:
The wafer is widely applied in modern microelectronics, power electronics, MEMS, and optoelectronic industrial manufacturing chains.
Comparison with Traditional Wafer Products:
Distinct from standard silicon plates and silicon oxide plates, silicon nitride plate owns unique comprehensive material advantages that single traditional substrates cannot match.
![]() |
![]() |
![]() |
![]() |
| Item | gas pressure sintering | hot pressing sintering | reactive sintering | pressureless sintering |
| Rockwell hardness (HRA) | ≥75 | - | > 80 | 91-92 |
| volume density(g/cm3) | 3.25 | > 3.25 | 1.8-2.7 | 3.0-3.2 |
| Dielectric constant (ε r20℃, 1MHZ) | - | 8.0(1MHz) | - | - |
| electric volume resistivity(Ω.cm) | 10¹⁴ | 10⁸ | - | - |
| breaking tenacity (Mpa m1/2) | 6-9 | 6-8 | 2.8 | 5-6 |
| Elasticity modulus (GPa) | 300-320 | 300-320 | 160-200 | 290-320 |
| thermal expansivity (m/K *10⁻⁶/℃) | 3.1-3.3 | 3.4 | 2.53 | 600 |
| thermal conductivity (W/MK) | 15-20 | 34 | 15 | - |
| weibull modulus (m) | 12-15 | 15-20 | 15-20 | 10-18 |
Development History

Patents and certification

Package

Services
FAQ
High Thermal Conductivity Alumina Nitride ALN Ceramic Insulation Part Component
Customized Boron Nitride rod bn ceramic rod
Ozone Ceramic Plate Blue Film Covered Ozonizer Ceramic Plate Air Sterilization Purification Parts
High-Precision Thick-Film Circuit Substrate Stable Signal Transmission for Automotive Electronics