Aluminum Nitride PCB Ceramic Plate Substrate Sheet,Aluminum Nitride Substrate Ceramic Insulation Electronic Component
Product Features
Aluminum nitride ceramics are widely used in semiconductor applications due to their good thermal conductivity and high electrical insulation properties. And aluminum nitride is non-toxic, grinding and processing will not produce dangerous steam. The thermal expansion coefficient and isolation coefficient of aluminum nitrode ceramic match very well with silicon wafer products, which makes it very effective in the application of heat dissipation in electronic products.
High purity (AlN ≥ 99%), thermal conductivity of 170-200W/m · K, thermal expansion coefficient of 4.5 × 10 ⁻⁶/℃ (matched with silicon chips), insulation resistance>10 ¹⁴Ω· cm, bending strength>300MPa, suitable for high-power density electronic heat dissipation.
Thermal conductivity comparable to metals, excellent insulation, high frequency performance, extreme temperature resistance, lightweight, solving the problem of thermal management in electronic devices.
It is a new type ceramic material with excellent comprehensive performance. Due to its extremely high thermal conductivity, aluminum nitride can meet the heat dissipation requirements of high-power devices such as optical communication, microwave communication, LED, and high-speed rail. It is considered to be an ideal material for the packaging of new generation semiconductor substrates and electronic devices.
It can be made as Aluminum nitride parts,Aluminum nitride plate,Aluminum nitride tube,Aluminum nitride rod,Aluminum nitride crucible etc.
Customized aluminum nitride parts are also welcomed but please provide your drawing.
Aluminum nitride ceramics have good thermal conductivity and high electrical insulation properties. It is non-toxic and does not generate dangerous vapors when ground and processed. The thermal expansion coefficient and isolation coefficient of aluminum nitride ceramics are very matched with silicon wafer products, which makes it very effective for heat dissipation applications in electronic products.
The Aluminum Nitride(AlN) ceramic has high thermal coductivity(5-10 times as the Alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance, and the linear expansion cofficient is similar with Si, which is widely used in communication compents, high power led, power electronic devices and other fields. Special spec products can be produced upon requests.
Metallized ALN Alumina Nitride Ceramic Plate Introduction
The AlN is an ideal choice for heat dissipation substrate in electrical applications and is non-toxic.
Color: gray
Size: according to clients' requirements or drawing.
Application: Widely used in communication devices, high brightness led, power electronic devices, optical communication devices, automotive electronic modules, etc.
DPC Metallized ceramic
Ceramic body and metal layer with the degree of thermal expansion coefficient, and good for thermal shock performance.
Continuous dense layer of metal, no spots, no cracks,no bubbles or be oxidized.
Outer metallization layer and the solid metal have a good binding strength
Dense ceramic body, no deformation, no cracks.
Metallized ceramic prototype to high volume production capacity
Technical Specifications
| Property Content | Unit | Property Index |
| Density | g/cm3 | ≥3.30g/cm3 |
| Water absorption | % | 0 |
| Thermal conductivity | (20 ℃,W/m.k) | ≥170 |
| Linear expansion coefficient | (RT-400℃,10-6) | 4.4 |
| Flexural strength | Mpa | ≥330 |
| Bulk resistance | Ω.cm | ≥1014 |
| Dielectric constant | 1 MHz | 9 |
| Dissipation factor | 1 MHz | 3 x 10-4 |
| Dielectric strength | KV/mm | ≥15 |
| Surface roughness | Ra(μm) | 0.3-0.5 |
| Camber | (~25.4(length)) | 0.03-0.05 |
| Appearance | - | Dense |
| Surface roughness can be reached 0.1μm after polished. | ||
| Size tolerance can be controlled in +-0.10mm with laser machined | ||
| Special specifications can be supplied upon requests. | ||
Features of aluminum nitride plate
1.High thermal conductivity, high voltage insulation
2. Resistance to high temperature and humidity
3. Good mechanical properties, high bending strength
4. Low dielectric constant, effective anti-interference of electronic signals
5.Excellent electrical insulation
6.Low density
7.Similar linear expansion coefficient with Si
8.Extremely high hardness
9.Humidity resistance
10.Good mechanical properties
11. Low dielectric constant, effective
against electronic signal interference
Advantages of Aln chip
good insulation and some other excellent properties. The ALN substrate is the best choice for a wide range of industrial insulating
heat sink material of high power machinery and equipments such as high-frequency equipment substrate, high power transistor module
substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products
Forming methods
Due to different forming methods, there are three types of aln ceramic in our company, Tap Casting AlN, Dry Pressed AlN and Hot Pressed AlN, tap casting is suitable for thin ceramic sheet of thickness<2mm, dry pressed and hot pressed is suitable for thick ceramic sheet and other shaped parts.
Application of Aluminum Nitride Ceramic disc
Heat sinks & heat spreaders
Chucks, clamp rings for semiconductor processing equipment
Electrical insulators
Silicon wafer handling and processing
Substrates & insulators for microelectronic devices & opto electronic devices
Substrates for electronic packages
Chip carriers for sensors and detectors
Laser heat management components
1. Optoelectronic communication equipment
2. High frequency microwave application device3. Automotive electronic modules
4. Application of aerospace military
electronics
5. LED/high power module
6. Electronic product cooling components
AlN ceramics use heat resistant melt erosion and thermal shock resistance, can produce GaAs crystal crucible, Al evaporation pan,
MHD power generation equipment, optoelectronic components, laser-semi-conductor, LED, IC products, and so on.Henka's AlN substrate
can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT),
LED packages for cooling and protecting circuits, packages and modules.
Application for electronics, communication, aviation, aerospace,metallurgy, petroleum, chemical, lighting, sports, medical, atomic energy, solar energy.
ALN are widely used in communication devices, high
brightness LED, power electronics, optical components, the application of special refrigerating unit, Automotive
electronic,modules, high efficiency power modules, high frequency microwave applications, power electronic components.
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