Product Details
1. Overview of porous ceramic
Aluminum Nitride (AlN) ceramic is a high-performance advanced structural and functional ceramic material specially developed for high-power electronics, semiconductor packaging, and high-temperature industrial applications. Compared with traditional alumina ceramics, AlN ceramics possess 5–10 times higher thermal conductivity, excellent electrical insulation, low dielectric loss, and silicon-matched thermal expansion performance. With ultra-high purity, stable mechanical properties and non-toxic characteristics, AlN ceramics have become the ideal heat dissipation and insulating substrate material for next-generation high-frequency, high-power, and miniaturized electronic devices.
Our factory provides a full range of AlN ceramic products, including AlN plates, AlN tubes, AlN rods, AlN crucibles, and customized special-shaped AlN parts. Custom precision machining and metallization treatment services are available to meet diverse industrial and scientific research requirements.
2. Core ALN Features
2.1 Superior Thermal Performance
AlN ceramics deliver excellent thermal conduction capability with a standard thermal conductivity of 170–200 W/m·K, and high-grade versions can reach up to 320 W/m·K. Its heat conduction efficiency is far beyond ordinary alumina and zirconia ceramics, close to metal-level heat dissipation performance. This feature ensures rapid and uniform heat transfer inside components, effectively solving the heat accumulation problem of high-power chips, LED modules and microwave devices, greatly improving equipment stability and service life.
With a stable high-temperature resistant structure, AlN ceramics maintain consistent thermal performance under long-term ultra-high temperature working conditions without thermal fatigue or performance attenuation.
2.2 Perfect Thermal Expansion Matching with Semiconductor Chips
AlN ceramic features an ultra-low thermal expansion coefficient of 4.5×10⁻⁶/°C, which is highly consistent with silicon wafers, gallium arsenide and other mainstream semiconductor materials. This unique matching property greatly reduces thermal stress and deformation during rapid heating and cooling cycles, effectively avoiding cracking, peeling and chip damage caused by thermal mismatch. It is the most reliable substrate material for precision semiconductor packaging.
2.3 Excellent Electrical Insulation & High-Frequency Performance
AlN ceramics own extremely high insulation resistance above 10¹⁴ Ω·cm, together with low dielectric constant and low dielectric loss. It maintains stable insulation performance under high voltage, high frequency and vacuum environments, effectively isolating current and preventing electromagnetic interference. Different from conductive ceramic materials, AlN will not cause leakage, short circuit or signal distortion, ensuring high-precision and high-stability operation of high-frequency communication, microwave and radio frequency equipment.
2.4 High Purity, Non-toxic & Safe Processing Performance
Our AlN products adopt high-purity raw materials with AlN purity ≥99%, with strictly controlled impurity content and no harmful components. The material is completely non-toxic and environmentally friendly. No dangerous gas or toxic steam will be generated during cutting, grinding and precision machining processes, ensuring safe production and laboratory use. In addition, AlN ceramics feature outstanding chemical corrosion resistance, resisting most acid and alkali erosion and molten metal contamination, guaranteeing ultra-high purity requirements for material sintering and semiconductor processing.
2.5 Outstanding Mechanical & Structural Stability
AlN ceramics possess high flexural strength above 300 MPa, with high hardness, low density and excellent wear resistance. The dense and pore-free ceramic structure enables strongthermal shock resistance and anti-oxidation performance. It will not deform, crack or break under repeated high and low temperature alternating working conditions, adapting to long-term continuous industrial operation and extreme environment application scenarios.
3. Forming Technology Classification
According to different molding and sintering processes, our AlN ceramics are divided into three mainstream production technologies to meet different product thicknesses and structural requirements:
Tape Casting AlN: Suitable for ultra-thin ceramic sheets with thickness below 2 mm, featuring uniform thickness, flat surface and high dimensional accuracy, widely used for precision substrate production.
Dry Pressed AlN: Applied for medium-thickness ceramic plates and regular-shaped structural parts, with stable batch performance and cost-effective mass production.
Hot Pressed AlN: High-density, high-thermal-conductivity premium grade, with compact grain structure and ultra-low porosity, suitable for high-end semiconductor and vacuum ultra-high-precision components.
4. Metallized AlN Ceramic Performance Advantages
Our DPC metallized AlN ceramic substrates adopt advanced composite processing technology. The ceramic body and metal layer have matched thermal expansion coefficients, providing excellent thermal shock resistance and bonding strength. The metallized layer isdense, uniform, bubble-free, crack-free and non-oxidized, with strong adhesion between metal and ceramic. The finished products feature no deformation, stable electrical conductivity and reliable heat dissipation performance, supporting mass production and customized prototype development.
5. Wide Application Fields
Benefiting from comprehensive superior performance, AlN ceramic parts are widely used in high-end manufacturing and precision scientific research fields:
Optoelectronic & LED Industry: High-power LED heat dissipation substrates, lighting module packaging, optoelectronic component carriers.
Semiconductor & Microelectronics: Silicon wafer processing chucks, insulating rings, chip carriers, sensor and detector substrates, semiconductor packaging base plates.
High-Frequency Microwave Communication: 5G communication components, microwave power devices, radio frequency equipment insulating and heat-dissipating parts.
Power Electronics: IGBT and MOSFET power module substrates, high-density hybrid circuit boards, power semiconductor heat spreaders.
Aerospace & Military Electronics: High-stability electronic insulating parts suitable for extreme temperature and complex environments.
Industrial High-Temperature Field: High-purity metal smelting crucibles, GaAs crystal growth containers, aluminum evaporation pans, high-temperature resistant and anti-corrosion industrial ceramic parts.
New Energy & Automobile Electronics: Automotive electronic modules, photovoltaic and solar energy equipment heat management components, new energy power conversion devices.
Medical, Chemical & Atomic Energy: Corrosion-resistant insulating structural parts and high-purity experimental containers.
6. Customization Service
We support full-size, full-shape customized AlN ceramic products, including special-shaped structural parts, ultra-thin sheets, thick plates, tubes, rods and crucibles. Customers can provide design drawings and technical parameters for personalized precision processing. Strict quality control, complete material certification and professional after-sales technical support ensure stable and reliable product performance for high-end industrial applications.
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