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1.Excellent thermal stability performance
2. Self lubricating workability
3.Ideal parts for melting and processing
1.The core advantage of boron nitride rods lies in their unique thermal management capabilities. It not only has excellent thermal conductivity (usually in the range of 30-60 W/m · K, and even higher for some oriented materials), but also can quickly conduct and disperse heat from the heat source area, avoiding the failure of electronic devices or high-temperature devices due to local overheating; At the same time, it is also an excellent electrical insulator that can maintain good insulation performance even at high temperatures. This rare combination of "high thermal conductivity" and "high insulation" makes it the preferred material for solving the contradiction between heat dissipation and insulation in high-power density electronic devices (such as IGBTs, lasers) and semiconductor manufacturing equipment (such as electrostatic chucks, heater bases). By using boron nitride rods as heat dissipation brackets or insulating heat transfer elements, the power density, operational stability, and service life of the equipment can be significantly improved
2.Boron nitride rings exhibit excellent stability in high-temperature environments. It can withstand high temperatures of 1800 ℃ for a long time in an inert atmosphere, and can also work stably above 1200 ℃ in atmospheric environments. Its uniqueness lies in its extremely low coefficient of thermal expansion (2.0-6.5) × 10 ⁻⁶/℃, which endows it with excellent thermal shock resistance. Whether rapidly cooled from a high-temperature environment or instantly put into high-temperature use, boron nitride rings can effectively resist thermal stress caused by rapid temperature changes, avoiding cracking or peeling. This characteristic makes it particularly suitable for use in thermal field components of crystal growth furnaces, metal heat treatment fixtures, and other harsh environments that require frequent thermal cycling, ensuring long-term reliability.
This unique performance combination enables it to quickly conduct heat in high-temperature environments while maintaining reliable electrical insulation. As a diffusion furnace fixture or plasma equipment insulation ring in semiconductor processes, it can effectively avoid process deviations caused by local overheating and ensure process stability. In a vacuum high-temperature environment, boron nitride rings can maintain structural integrity and performance stability, providing a durable and reliable thermal management solution for equipment, significantly improving equipment service life and process yield.
3.Based on the layered crystal structure of hexagonal boron nitride, the boron nitride ring has an extremely low friction coefficient (0.2-0.4) and exhibits excellent self-lubricating performance. This characteristic makes it an ideal material for moving parts such as bearings and seals in special environments where traditional lubricants cannot be used, such as high temperatures and vacuum. At the same time, boron nitride rings have excellent corrosion resistance to most molten metals (such as aluminum, copper, molten steel) and molten salts, and their chemical properties are extremely stable. As a continuous casting separation ring in the metallurgical industry or as a forming mold in the glass manufacturing industry, it can effectively resist melt erosion, extend its service life, and ensure the stability of product quality.
4.Unlike other high-performance ceramics, boron nitride ring materials have relatively low Mohs hardness (about 2) and can be precision machined using conventional processing methods. This characteristic enables boron nitride rings to be processed into various complex shapes and precise sizes according to specific application requirements, including non-standard inner diameters, special groove shapes, irregular holes, etc. From precision insulation rings in semiconductor equipment to special components in scientific research instruments, precise size control and surface finish requirements can be achieved. This processing flexibility greatly reduces the manufacturing cost and cycle of complex structural components, providing reliable customized solutions for special application scenarios.
5.Boron nitride ring, as a key basic material, is widely used in multiple high-end industrial fields. In the semiconductor industry, it is used as a carrier ring for diffusion processes and insulation components for plasma etching equipment; In the metallurgical industry, as a separation ring for continuous casting, it effectively improves the quality of castings; In the aerospace field, it is used as insulation components and supports for high-temperature vacuum furnaces. In addition, boron nitride rings play an irreplaceable role in special glass forming, composite material processing, scientific research experimental equipment and other scenarios. Its comprehensive performance advantages make it an important material foundation for promoting the development of modern industrial technology, providing strong support for technological innovation in various industries.

Hot Pressed Boron Nitride
| Item | Unit | Index | |
| Thermal Conductivity (RT) | W/m·k | 45-50 | |
| Thermal expansivity (25-700℃) | 10⁻⁶/℃ | 6.5-7.5 | |
| Resistivity (RT) | Ω·m | >10¹² | |
| Puncture voltage | 10⁶ kV·m | 2.5-4.0 | |
| Mohs' hardness | - | 2 | |
| Dielectric constant (Σ) | - | 3.8-4.3 | |
| Bending strength (RT) | mpa | >35 | |
| Compression strength (RT) | mpa | >200 | |
| Density | g/cm³ | 1.9-2.2 | |
| Chemical Composition | B+N | % | 99.5 |
| Oxygen Content | % | <0.4 | |
| Carbon Content | % | <0.02 | |
| Working Environment Temperature | Oxidizing Atmosphere | ℃ | 850 |
| Vacuum | ℃ | 1800 | |
| Inertia | ℃ | 2300 | |
Pyrolytic Boron Nitride
| Item | Unit | Index | |
| Lattice Constant | μm | a: 2.504×10⁻¹⁰; c: 6.692×10⁻¹⁰ | |
| Apparent Density | g/cm³ | 2.10–2.15 (Plate); 2.15–2.19 (Crucible) | |
| Helium Transmittance | cm³/s | 1×10⁻¹⁰ | |
| Micro Hardness (Knoop) (abflat) | N/mm² | 691.88 | |
| Volume Resistivity | Ω·cm | 3.11×10¹¹ | |
| Tensile Strength (Force || "C") | N/mm² | 153.86 | |
| Bending Strength | (Force || "C") | N/mm² | 243.63 |
| (Force ⊥ "C") | N/mm² | 197.76 | |
| Elasticity Modulus | N/mm² | 235690 | |
| Thermal Conductivity | W/m·k | "a" direction "c" direction | |
| 200℃ | W/m·k | 60 2.60 | |
| 900℃ | W/m·k | 43.70 2.80 | |
| Dielectric Strength (RT) | KV/mm | 56 | |

