Aluminum nitride copper plated ceramic substrate Insulator AIN Ceramic Sheet

                                                                                                Product Details                                                                                       

1. Overview of Aluminum Nitride (AlN) Ceramic Sheets

1.1 General introduction
Aluminum Nitride (AlN) ceramic sheet is a high-performance flat plate ceramic with ultra-high thermal conductivity and outstanding high-voltage insulation. It delivers efficient heat dissipation for power chips and power modules, widely adopted in semiconductor packaging, aerospace and high-frequency electronic devices as an upgraded alternative to ordinary alumina ceramic substrates.

1.2 Chemical Composition & Microstructure

• Single-phase pure AlN ceramic mixed with trace sintering additives to form compact fine crystal microstructure.
  
• Zero water absorption, dense solid flat plate without internal voids or penetrating pores.
  
• Density ≥3.30 g/cm³, uniform stable crystal structure free of hidden microcracks.
  

2. Manufacturing Process

2.1 Raw Material Batching & Mixing

High-purity AlN powder blended with sintering additives, uniformly ball milled to eliminate particle agglomeration.
Step A: Dry-press raw powder into flat ceramic green sheets.
Step B: High-temperature sintering under nitrogen atmosphere to complete crystal growth.
Step C: Controlled constant-temperature cooling to avoid internal residual stress and microcracks.

2.2 Precision Cutting & Controllable Machining

Step A: Sintered large ceramic slabs cut into standard-size sheets.
Step B: Double-side fine grinding to unify surface roughness and dimensional flatness.
Secondary annealing treatment to release forming stress, prevent sheet cracking during precision laser cutting.

2.3 Blank Finishing & Semi-finished Stock
Grind top and bottom surfaces of slabs to unified dimensional standards; conduct X-ray inspection to screen out blanks with internal defects. Qualified semi-finished AlN sheets are supplied for customers’ subsequent copper plating and circuit processing.

3. Core Performance Profile (Defining Feature)

3.1 Dominant Thermal Performance

• Thermal conductivity ≥170 W/m·k at 20℃, non-toxic material realizing rapid heat dissipation for high-power electronic components.
  
• Linear expansion coefficient 4.4×10⁻⁶ (RT-400℃), well-matched with copper foil for stable direct copper bonding and metal packaging.
  
• Excellent thermal shock resistance, stable long-term service below 800℃ without warping or cracking under rapid heating & cooling cycles.
  

3.2 Excellent Electrical Insulation

• Bulk resistance ≥10¹⁴ Ω·cm, maintains reliable insulating performance across full temperature and frequency ranges.
  
• Dielectric constant 9.0 (1MHz), dissipation factor 3×10⁻⁴, dielectric strength ≥15 KV/mm.
  
• Stable insulation under continuous high-frequency and high-voltage loads, far better than polymer plastics that degrade rapidly under high temperature.
  

3.3 Chemical & Vacuum Compatibility

• Resistant to most acids, alkalis and organic solvents; only susceptible to corrosion by hydrofluoric acid and strong molten alkali metals.
  
• Zero outgassing after high-temperature baking, fully compatible with ultra-high vacuum (UHV) semiconductor processing chambers.
  
• Stable under X-ray and gamma particle irradiation, suitable for nuclear and aerospace precision structural substrates.
  

3.4 Mechanical & Safety Performance

• Flexural strength ≥330 MPa, rigid flat plate structure with strong compression resistance.
  
• Original surface roughness Ra 0.3~0.5μm; polished sheet surface reaches Ra ≤0.1μm for tight copper foil adhesion.
  
• Camber only 0.03~0.05 per 25.4mm length, ultra-flat uniform sheet surface ideal for DBC copper plating.
  
• Non-toxic inorganic raw material, wear-resistant double sides to extend service life under long-term thermal cycling.

4. Key Limitations

• Not applicable for continuous long-term operation in environments above 800℃.
  
• Surface will be etched and damaged when exposed to hydrofluoric acid.
  
• Lower hardness than alumina and silicon carbide, not the first choice for heavy-duty severe abrasion working conditions.
  

5. Main Industrial Applications

5.1 Vacuum & Semiconductor
Semiconductor chip packaging substrates, UHV equipment heat-conducting insulation plates, power module cooling substrates.
5.2 Aerospace & Spacecraft
Satellite power device thermal isolation substrates, radiation-resistant flat structural plates.
5.3 High-Voltage Power Electronics
IGBT module DBC copper-clad substrates, high-frequency transformer insulation plates, laser device heat dissipation base sheets.
5.4 Optics & Precision Instruments
Optical equipment heat-conducting isolation plates, precision testing instrument insulating substrates.
5.5 Medical & Nuclear Industry
Radiation shielding test flat jigs, pollution-free laboratory high-voltage insulation substrates.

6. Material Positioning
Aluminum Nitride (AlN) ceramic sheet fills the performance gap between plastic insulation boards and ordinary alumina ceramic substrates. It integrates ultra-high thermal conductivity and stable high-frequency insulation performance. Compared with glass ceramics and alumina substrates, it provides superior heat dissipation efficiency and perfect copper foil bonding compatibility, making it the preferred flat substrate material for customized high-power electronics, semiconductor packaging and aerospace precision equipment.

Parameter

                                                                                          Development History                                                                                    

                                                                                        Patents and certification                                                                                  

                                                                                               Package                                                                                                    

                                                                                           Services                                                                        

                                                                                               FAQ