Alumina Micro Porous Ceramic Vacuum Chuck for Semiconductor and Silicon Wafer

Core Advantages

• （1）High porosity and uniform pore size enable low resistance for both gas and liquid flow through applications，Good rigidity and dimensional stability.Ceramic material has a high hardness (Mohs hardness ≥8), can withstand high temperatures (up to over 500°C), and is resistant to various acid and alkali corrosions. It has a long service life, which is 3 to 5 times that of traditional suction cups.
• （2）Excellent chemical resistance in both acid and alkaline conditions，Low resistance for both gas and liquid flow through application.The micron-level porous structure ensures uniform suction distribution. Even if the workpiece surface has slight unevenness, it can still firmly adhere. It is particularly suitable for ultra-thin and fragile materials such as glass and silicon wafers.
• （3）Uniform pore sizes and high surface areas，Good acid and alkali resistance.The surface is smooth and not prone to material adhesion or clogging, significantly reducing the frequency of cleaning and shutdown maintenance, and lowering operating costs

Parameter

Application scenarios

• Chip packaging: Fixed chip substrates and ceramic substrates, suitable for the high-speed transfer and positioning requirements of automated production lines
• Optical lens processing: Adsorb quartz glass and optical lenses, used in polishing, coating and other processes to prevent lens deformation or contamination
• Mold polishing: Fix the high-precision mold cavity to ensure positional stability during the polishing process and enhance surface finish.
• Display manufacturing: Fixing OLED and LCD glass substrates to meet the requirements of non-destructive handling and processing of ultra-thin substrates。
• Silicon wafer/wafer processing: During photolithography, cutting, grinding and other processes, precisely adsorb 2-12 inch silicon wafers to prevent surface scratches and ensure processing accuracy.
• Medical devices: used for the manufacturing and testing of microfluidic chips, biochips and precision ceramic components.
• Battery manufacturing: It is used for the precise handling and processing of lithium battery electrode sheets, solid electrolytes and fuel cell bipolar plates.
• PCB/FPC: It provides reliable vacuum adsorption during SMT assembly, AOI inspection, laser drilling and panel separation
• Aerospace and national Defense: It plays a role in the ultra-precision manufacturing of avionics, inertial devices and guidance components.